TERACT · RTN-Null Cell

Extended architecture and validation detail

Product view for preliminary review. It presents functional layers, expected KPIs and an expanded experimental path without disclosing exact geometry, fine composition or figures reserved for confidential material.

Design principle

  • Interface control to reduce read variability.
  • Functional separation between the active region and the support region.
  • Path compatible with CMOS BEOL manufacturing.

Stack scheme

Functional device architecture

The stack is organized by electrical and interfacial functions. The intention is to control vacancy dynamics and preserve read stability during operation.

Top layer Top electrode

Metal interface aimed at stable and reproducible contact with standard process materials.

Active region Switching sublayer

Region designed to enable resistive switching under a controlled distribution of active defects.

Support region Insulating bulk sublayer

Layer with structural and electrical support function, oriented to contain leakage and stabilize the functional interface.

Bottom layer Bottom electrode

Base compatible with BEOL integration and comparative evaluation against control cells.

The layer names and functions shown describe the architectural principle. Precise geometries, process recipes and fine parameters are reserved for controlled technical review.

Expected KPIs

Target metrics, subject to validation

These indicators represent performance hypotheses and must be validated through test lots, statistical analysis and comparison against reference structures.

To validate

Read stability

Lower dispersion across cycles and a more consistent read window in HRS.

To validate

Reduced noise

Reduced RTN/TLS signatures under operating conditions relevant to resistive memory.

To validate

Multilevel path

Better conditions to explore stable intermediate states in MLC/TLC schemes.

Expanded experimental path

Proposed evaluation sequence

Expanded validation is posed as a staged process, with emphasis on repeatability, interfaces and comparison against control.

1. Initial comparative lot

Fabrication of experimental and control devices under nearby process windows, to separate architectural effect from manufacturing variation.

2. Electrical characterization

I-V reads, resistive state distribution, temporal stability and behavior under repeated programming sequences.

3. Noise analysis

Observation of RTN/TLS signatures, interfacial behavior and correlation with resistance states in operation.

4. Integration assessment

Review of compatibility with CMOS BEOL sequences, standard materials and possible industrial adoption limitations.

Next step

Request whitepaper or technical conversation

Complete documentation and any discussion of reserved parameters are handled through direct request and, when applicable, under NDA.